昂科烧录器软件_ V1.05.23(20230401)正式版本发布通知-软件更新-昂科烧录器_ic烧录机_全自动ic烧录机

Dear All:

昂科软件_ V1.05.23(20230401)今日发布，如有需要，请前往官网下载，链接:

下载链接（先注册-登录-再到软件下载中心-下载）https://www.acroview.com/member/login/

烧录器软件适用机型：

A：手动烧录器：AP8000、AP8000F、PT100

B：全自动烧录器：IPS7000、IPS5000、IPS-MINI PRO、PH-A2000、IPS3000、EAP5000、IPS5100、IPS5200

更新芯片列表如下：

V1.05.23_20230401
Acroview	Programmer Type	Items	Manufacture	Chip Name	Package	Adapter	Description
		New Devices	Altera	10M04SCU169(POF)	BGA169(11x11)	BGA169(11x11)-AG01
			Altera	10M08SCU169(POF)	BGA169(11x11)	BGA169(11x11)-AG01
			ArteryTek	AT32F407VGT	LQFP100(14x14)	TQFP100(14x14)-AG07(F)
			Atmel	ATSAM3S1BB-AU	TQFP64(10x10)	TQFP64(10x10)-AG69
			C-Core	CCFC2012BC60L5	TQFP144(20x20)	TQFP144(20x20)-AG98
			Cypress	CY8C4245LQ*-483	QFN40(6x6)	QFN40(6x6)-AG21
			Cypress	CY91F526JSE-GSE2(ALP)	LQFP120(16x16)	TQFP120(16x16)-AG10
			Cypress	S6J336CHTB	TQFP144(16x16)	TQFP144(16x16)-AG03
			Cypress	S6J336CHTB(ALP)	TQFP144(16x16)	TQFP144(16x16)-AG03
			Cypress	S6J342AFTB	TQFP100(14x14)	TQFP100(14x14)-AG158
			Cypress	S6J342AFTB(ALP)	TQFP100(14x14)	TQFP100(14x14)-AG158
			EON	EN25S32A-*XF	USON8(2x3mm)	DFN8(2x3)-AG01
			FORESEE	FEMDRM008G-58A39	BGA153(11.5x13)	BGA153(11.5x13)-AG01
			FudanWei	FM33A048EV	LQFP80(12x12)	PQFP80(12x12)-AG18
			GigaDevice	GD32F307VGT	LQFP100(14x14)	TQFP100(14x14)-AG07(F)
			GOWIN	GW1N-UV2QN32	QFN32(5x5)	QFN32(5x5)-AG129
			GOWIN	GW1N-UV4PG256	BGA256(17x17)	BGA256(17x17)-AG16
			HDSC	HC32F003C4P	TSSOP20(4.4x6.5)	TSSOP20(4.4x6.5)-AG05
			HolyChip	HC89S003B	TSSOP20(4.4x6.5)	TSSOP20(4.4x6.5)-AG33
			INGCHIPS	ING91880C	QFN32(4x4)	QFN32(4x4)-AG71
			Lattice	LCMXO3LF-2100E-*MG121	csfBGA121(6x6)	BGA121(6x6)-S01
			Lattice	LCMXO3LF-2100E-*MG121	BGA121(6x6)	BGA121(6x6)-AG01
			Lattice	LCMXO2280C-*FTN324	BGA324(19x19)	BGA324(19x19)-S04
			Macronix	MX25L128356M	SO16(300mil)	SO16(300)-AG01
			Macronix	MX25L128356M2	SOP8(208mil)	SO8(210)-AG01
			Macronix	MX25L128356Z2	WSON8(8x6mm)	VPDFN8(8x6)-AG01
			Macronix	MX25L128356ZN	WSON8(6x5mm)	VPDFN8(6x5)-AG01
			Macronix	MX25LM25645GXD	TFBGA 6x8 24ball(5x5 ball array)	TBGA24(8x6)-AG01
			Macronix	MX25LW51245GXD	TFBGA 6x8 24ball(5x5 ball array)	TBGA24(8x6)-AG01
			Macronix	MX25U16356ZC	XSON8(4x4mm)	DFN8(4x4)-AG01
			Macronix	MX25U16356ZN	WSON8(6x5mm)	VPDFN8(6x5)-AG01
			Macronix	MX25U51241GM	SOP16(300mil)	SO16(300)-AG01
			Macronix	MX25U51241GXD	BGA24(6x8mm,5x5 BallArray)	TBGA24(8x6)-AG01
			Macronix	MX25U51241GZ4	WSON8(8x6mm)	VPDFN8(8x6)-AG01
			Macronix	MX25UM51245GXX	TFBGA 6x8 24ball(5x5 ball array)	TBGA24(8x6)-AG01
			Macronix	MX66L1G45JM	SOP16(300mil)	SO16(300)-AG01
			Macronix	MX66L1G45JXD	BGA24(6x8mm,5x5 BallArray)	TBGA24(8x6)-AG01
			Macronix	MX66L1G45JZ4	WSON8(8x6mm)	VPDFN8(8x6)-AG01
			Macronix	MX66L1G65GM	SOP16(300mil)	SO16(300)-AG01
			Macronix	MX77U25655FM	SOP16(300mil)	SO16(300)-AG01
			Macronix	MX77U25655FZ4	WSON8(8x6mm)	VPDFN8(8x6)-AG01
			Macronix	MX77U51255FM	SOP16(300mil)	SO16(300)-AG01
			Macronix	MX77U51255FZ4	WSON8(8x6mm)	VPDFN8(8x6)-AG01
			Microchip	ATSAML11E15A	TQFP32(7x7)	TQFP32(7x7)-AG67
			Microchip	ATSAMD21J18A-M	QFN64(9x9)	QFN64(9x9)-AG22
			Microchip	25LC040A-*/SN(DLY30S)	SOP8(150mil)	SO8(150)-AG01
			MPS	MP6616GD	QFN10(2x3)	QFN10(2x3)-AG01
			Nation	N32L406CBL	LQFP48(7x7)	TQFP48(7x7)-AG07CVT-AG01
			PUYA	P25Q32SN-NX	USON8(3x4mm)	DFN8(3x4)-AG01
			PUYA	P25Q32SN-SS	SO8(150mil)	SO8(150)-AG01
			PUYA	P25Q32SN-SU	SO8(208mil)	SO8(210)-AG01
			PUYA	P25Q32SN-TS	TSSOP8	TSSOP8-AG02
			PUYA	P25Q32SN-UX	USON8(3x2mm)	DFN8(2x3)-AG01
			PUYA	P25Q32SN-WX	WSON8(6x5mm)	VPDFN8(6x5)-AG01
			Raydium	RM23011	QFN20(3.5x3.5)	QFN20(3.5x3.5)-AG01
			Rayson	RS70B16G4S10F	BGA153(11.5x13)	BGA153(11.5x13)-AG01
			Renergy	RN8217(Option)	LQFP100(14x14)	TQFP100(14x14)-AG141
			Renesas	R5F10RJC*FA	TQFP52(10x10)	TQFP52(10x10)-AG03
			Renesas	R7FA2A1AB*CFM	TQFP64(10x10)	TQFP64(10x10)-AG163
			RICHTEK	RT7860	QFN48(6x6)	QFN48(6x6)-AG85
			RICHTEK	RT3635BE-03	QFN60(7x7)	QFN60(7x7)-AG05
			SanDisk	SDINBDV4-32G	BGA153(11.5x13)	BGA153(11.5x13)-AG01
			SanDisk	SDINBDV4-64G	BGA153(11.5x13)	BGA153(11.5x13)-AG01
SanDisk	SDINBDA6-16G		BGA153(11.5x13)	BGA153(11.5x13)-AG01
Silicon Laboratories	EFM8BB31F32*-D-QFN32	QFN32(4x4)	QFN32(4x4)-AG03
SPINTROL	SPC1168(ISP-SWD-3.3VTTL-3.3V)	NULL	ISP-S01
ST	STM32L431CBT	TQFP48(7x7)	TQFP48(7x7)-AG05
ST	STM32F205RET	TQFP64(10x10)	TQFP64(10x10)-AG01(K)
ST	STM32L031G6U	QFN28(4x4)	QFN28(4x4)-AG18
ST	STM32G491CCT	TQFP48(7x7)	TQFP48(7x7)-AG85
ST	STM32G474CBT(ENTEDRV9)	LQFP48(7x7)	TQFP48(7x7)-AG85
ST	STM32G474CBT(Optimizer)	LQFP48(7x7)	TQFP48(7x7)-AG85
STC	STC15W4K48S4-30*-LQFP32	LQFP32(7x7)	TQFP32(7x7)-S56
STC	STC15W4K48S4-30*-LQFP48	LQFP48	TQFP48(7x7)-S156
TI	TMS320F28035(ISP-JTAG-3.3VTTL-3.3V)	NULL	JTAG(C2000)-CVT01-S01
Winbond	W25Q20CLSN	SOIC8(150mil)	SO8(150)-AG01
Winbond	W25Q20CLSV	VSOP8(150mil)	SO8(150)-AG01
Winbond	W25Q20CLUX	USON8(2x3mm)	DFN8(2x3)-AG01
Winbond	W25Q20CLZP	WSON8(6x5mm)	VPDFN8(6x5)-AG01
X-SignalIntegrated	XM2616	QFN24(4x4)	QFN24(4x4)-AG56
Update Devices	HED	HD8040B	WLCSP48(2.780x2.933)	WLCSP48(2.780x2.933)-S01	Update: Fix the software stuck exception when pressing the program

					(You must carefully confirm the config option and redo the project to load and burn)
	Altera	EPM1270T144*5N(POF)	TQFP144(20x20)	TQFP144(20x20)-AG11	Update: Added TAG17 checksum display.

					(You must carefully confirm the config option and redo the project to load and burn)
	ChipOn(KungFu)	KF32A141IQS	TQFP48(7x7)	TQFP48(7x7)-AG106	Update: Fixed the failure of some chips to burn into mode

					(You must carefully confirm the config option and redo the project to load and burn)
	GMT	KA731	QFN40(5x5) 0.4	QFN40(5x5)-AG25	Update: Solve the yield problem of some batches

					(You must carefully confirm the config option and redo the project to load and burn)
	HOLTEK	HT50F83(ISP-ICP-4.5VTTL-5.0V)	NULL	ISP-AG08	Update: Changed seat ISP-AG17 to ISP-AG08

					(You must carefully confirm the config option and reload the project burn)
	ISSI	IS25LP064D-JB	SOIC8(208mil)	SO8(210)-AG01	Update: Added checksum reverse display

					(You must carefully confirm the config option and redo the project to load and burn)
	Microchip	dsPIC33EP256MC206-*/MR	QFN64(9x9)	QFN64(9x9)-AG05	Update: Speed up

					(You must carefully confirm the config option and redo the project to load and burn)
	Micron	MTFC4GACAJCN-1M	BGA153(11.5x13)	BGA153(11.5x13)-AG01	Update: Update the algorithm

					(You must carefully confirm the config option and redo the project to load and burn)
	MPS	HR1211GY	SO20(300)	SO20(300)-AG17	Update: Added CRC Check Fail print

					(You must carefully confirm the config option and redo the project to load and burn)
	RICHTEK	RTQ6751GQWT(TRIM)	QFN40(6x6)	QFN40(6x6)-AG24	Update: Modified config

					(You must carefully confirm the config option and redo the project to load and burn)
	RICHTEK	RT7083(ISP-IIC-5VTTL-5V)	NULL	ISP-AG17	Update: Changed chip name

					(You must carefully confirm the config option and reload the project burn)
	RICHTEK	RT7807N-A	QFN32(4x4)	QFN32(4x4)-AG68	Update: Modified according to the latest manual, the modified content is the length of ID check, and more mask value to determine whether the corresponding value is tested

					(You must carefully confirm the config option and redo the project to load and burn)
	SinoWealth	SH32F9062*P_044PR(NOPF)	LQFP44(10x10)	LQFP44(10x10)-AG45	Update: Solve the problem of burning customer files, empty chip 20% bad, and file running

					(You must carefully confirm the config option and redo the project to load and burn)
	ST	STM8S003F3U	UFQFPN20(3x3)	QFN20(3x3)-AG02	Update: Added option checksum display

					(You must carefully confirm the config option and reload the project burn)
	Toshiba	TH58NYG3S0HBAI4	P-TFBGA63-0911-0.80CZ(9x11)	BGA63(9x11)-AG01	Update: Resolve the verify fail issue

					(You must carefully confirm the config option and redo the project to load and burn)
	Winbond	W25Q16JVSS*Q(ISP)	NULL	ISP-S01	Update: Added UID function

					(You must carefully confirm the config option and redo the project to load and burn)
GUI modifcations	V1.4.18 1.非标准Hex档案，比如有多个结束符，提示用户错误还是继续解析
Firmware modifications
MultiAprog modifications	V1.3.10 1.加快MesClientApp退出速度 2.修改电子检测打开后，发送Cmd3失败，然后stdmes在stopservice卡死的问题

------------------Best wishes--------------------

昂科技术成立于2013年2月，2016年被认定为国家高新企业和深圳市高新企业，并取得多项软件著作权以及专利，昂科核心人员均拥有编程设备研发、制造以及服务领域十多年的丰富经验，具有世界领先技术，并致力于为客户提供创新的芯片编程器解决方案和产品。正努力为编程设备的可靠性、安全性以及知识产权保护方面做出杰出贡献。昂科始终坚信对品质与技术的追求会使越来越多的电子厂商选择昂科作为他们值得信赖的合作伙伴，新产品持续在发布中，请保持关注。

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昂科烧录器软件_ V1.05.23(20230401)正式版本发布通知